YBS-D02 possesses excellent heat transfer capabilities, good insulation properties, superior environmental performance, and good material compatibility. It is currently the mainstream liquid cooling medium used in semiconductor manufacturing processes such as dry etching, wafer testing, and packaging testing.
It can also be widely used as an engineering liquid for leak detection, thermal shock testing, insulation testing, and high-temperature aging testing. Its resistance to high voltage surges also makes it suitable for use as a cooling medium in high-speed train traction transformers.
Performance characteristics
Good environmental conditions do not harm the ozone layer.
High chemical inertness.
Excellent heat conduction medium.
Chemical and thermal stability.
Non-toxic.
Performance characteristics
| Typical Properties | Units | YBS-D02 | Typical Properties | Units | YBS-D02 |
| Boiling point | ℃ | 175 | Thermal conductivity at 25 °C | W/m·℃ | 0.07 |
| Pour point | ℃ | -97 | Coefficient of expansion | cm³ / cm³ · ℃ | 0.0011 |
| Pour point | G/cm 3 | 1.77 | Surface tension | Dyne/cm | 16 |
| Density at 125 °C | G/cm 3 | 1.54 | Dielectric strength | kV (2.54 mm gap) | 40 |
| Kinematic viscosity at 25 °C | cSt | 1.80 | Dielectric constant | 2.1 | |
| Kinematic viscosity at 125 °C | cSt | 0.46 | Volume resistivity | Ohm·cm | 5·10 15 |
| Specific heat at 25 °C | J/Kg·℃ | 973 | Average molecular weight | Amu | 760 |
Application and Packaging Specifications
This product is supplied in 1KG and 5KG 25KG 200KGdrum packaging.
Contact Us
ADD: Building 15, No. 142, Jinghai West Road, Chang'an Town, Dongguan City, Guangdong Province, China